3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and bare die and wafer level stacking technology meeting the demand for high reliability and very small size of today’s and tomorrow’s electronics. 3D PLUS is recognized as a high performance innovator in the design and manufacturing of miniaturized 3D modules for more than 20 years. With a capability of stacking up to 10 semiconductor devices within 1mm, 3D PLUS ultra-low profile modules are unique.

CNES, ESA, NASA, JPL, ROSKOSMOS, JAXA, ISRO, DLR, THALES, SAFRAN, AIRBUS