TECHCI RHÔNE-ALPES

205 route de la Plaine

73240 SAINT GENIX GUIERS

Contact : TARUFFI Richard

Salon du Bourget 2019 - Stand : E134

Business areas

Sub-contracting

Presentation

Printed Circuits Boards Manufacturing High Technology Multilayers and Flex-Rigid HDI, Blind vias...Via Filling Copper Prototypes and Serial production volumes Aeronautic, Military and Industrial Applications Certification ISO 9001 / EN 9100 NADCAP Accreditation

Cluster

Member of the cluster : Aeronautic Cluster Rhône-Alpes

Aircraft program / defense : A320, A350, A380, A400M, Rafale, Falcon...

Turnover / export

Turnover : 16500 K€ Workforce : 130

Export Turnover : 3200 K€

Activity

Aerospace Aerospace 41 %
Defense / security & civil protection Defense / security & civil protection 25 %

Expertise

Multilayers 3 to 22 layers (and more) Burried Vias Micro-via (HDI) Via Plug Circuits with Heat Sink- Press Fit Hyper Frequency PCB Thickness until 6 mm Tracks/Spaces mini 70µ Mechanical Holes 0.2mm Laser Micro-vias 100 µ Flexibles & Rigid Flex Multilayer

Qualifications

Certification ISO 9001 - AFAQ EN 9100 Attestation QUALIFAS / ASD EASE UL 94 VO NADCAP

Customer references

AIRBUS, THALES, SAFRAN, ZODIAC, DASSAULT.....

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