205 route de la Plaine
73240 SAINT GENIX GUIERS
Contact : TARUFFI Richard
Sub-contracting
Printed Circuits Boards Manufacturing High Technology Multilayers and Flex-Rigid HDI, Blind vias...Via Filling Copper Prototypes and Serial production volumes Aeronautic, Military and Industrial Applications Certification ISO 9001 / EN 9100 NADCAP Accreditation
Member of the cluster : Aeronautic Cluster Rhône-Alpes
Aircraft program / defense : A320, A350, A380, A400M, Rafale, Falcon...
Turnover : 16500 K€ Workforce : 130
Export Turnover : 3200 K€
Aerospace 41 %
Defense / security & civil protection 25 %
Multilayers 3 to 22 layers (and more) Burried Vias Micro-via (HDI) Via Plug Circuits with Heat Sink- Press Fit Hyper Frequency PCB Thickness until 6 mm Tracks/Spaces mini 70µ Mechanical Holes 0.2mm Laser Micro-vias 100 µ Flexibles & Rigid Flex Multilayer
Certification ISO 9001 - AFAQ EN 9100 Attestation QUALIFAS / ASD EASE UL 94 VO NADCAP
AIRBUS, THALES, SAFRAN, ZODIAC, DASSAULT.....